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 MAAM26100
GaAs MMIC Power Amplifier 2.0 - 6.5 GHz
Features
* * * * * * Saturated Power: 30.5 dBm Typical Gain: 19 dB Typical Power Added Efficiency: 30% On-Chip Bias Network DC Decoupled RF Input and Output RoHS* Compliant Rev. V6
Die
Description
The MAAM26100 is a GaAs MMIC two stage high efficiency power amplifier. The MAAM26100 is a fully monolithic design which eliminates the need for external circuitry in 50-ohm systems. The MAAM26100 is ideally suited for driver amplifiers and transmitter outputs in UMTS applications, test equipment, electronic warfare jammers, missile subsystems and phased array radars. The MAAM26100 is fabricated using a mature 0.5-micron gate length GaAs process. The process features full passivation for increased performance reliability.
Absolute Maximum Ratings 1,2
Parameter VDD VG1, VG2 VGG3 Absolute Maximum +9 V -2.5 V to -0.8 V -6 V to -3 V +17 dBm 150C -65C to +150C
Ordering Information
Part Number MAAM26100 Package Die
RF Input Power Channel Temperature Storage Temperature
1. Exceeding any one or combination of these limits may cause permanent damage to this device and will void product warranty. 2. M/A-COM does not recommend sustained operation near these survivability limits. 3. VGG rating applies when using the optional on-chip resistor network.
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 * Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, * India Tel: +91.80.43537383 * China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.
MAAM26100
GaAs MMIC Power Amplifier 2.0 - 6.5 GHz
Electrical Specifications: TA = 25C, Z0 = 50 , VDD = +8 V, VGG = -1.3 V nominal
Parameter Small Signal Gain Input VSWR Output VSWR Saturated Output Power Output Power at 1 dB Gain Compression Power Added Efficiency Third Order Intercept Reverse Isolation Bias Current Thermal Resistance 4
4. Attachment method not included.
Rev. V6
Test Conditions 2 - 6 GHz 2 - 6 GHz 2 - 6 GHz Input Power +14 dBm, 2 - 6 GHz 2 - 6 GHz -- 2 - 6 GHz 2 - 6 GHz No RF PIN = +14 dBm --
Units dB Ratio Ratio dBm dBm % dBm dB mA mA C/W
Min. 15 --- -- 29 -- -- -- -- -- -- --
Typ. 19 2.0:1 2.2:1 30.5 28 30 39 30 390 475 14
Max. -- -- -- -- -- -- -- -- -- 650 --
Schematic
VD1 VGG VG2 GND VD2
RF OUT RF IN
VG1
E1
D1
C1
B1
A1
VG2
GND
E2
D2
C2
B2
A2
2
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 * Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, * India Tel: +91.80.43537383 * China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.
MAAM26100
GaAs MMIC Power Amplifier 2.0 - 6.5 GHz
Typical Performance Curves
Input Return Loss
0
Rev. V6
Gain
25
-5
20
-10
15
-15
10
-20
5
-25 1.5 2.5 3.5 4.5 5.5 6.5 7.5
0 1.5
2.5
3.5
4.5
5.5
6.5
7.5
Frequency (GHz)
Frequency (GHz)
Power Added Efficiency @ PIN = +14 dBm
50
Output Power @ PIN = +14 dBm
34
40
32
30
30
20
28
10
26
0 1.5
2.5
3.5
4.5
5.5
6.5
7.5
24 1.5
2.5
3.5
4.5
5.5
6.5
7.5
Frequency (GHz)
Frequency (GHz)
3
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 * Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, * India Tel: +91.80.43537383 * China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.
MAAM26100
GaAs MMIC Power Amplifier 2.0 - 6.5 GHz
Handling Procedures
Permanent damage to the MAAM26100 may occur if the following precautions are not adhered to: A. Cleanliness - The MAAM26100 should be handled in a clean environment. DO NOT attempt to clean assembly after the MAAM26100 is installed. B. Static Sensitivity - All die handling equipment and personnel should comply with DOD-STD1686 Class I. C. Transients - Avoid instrument and power supply transients while bias is connected to the MAAM26100. Use shielded signal and bias cables to minimize inductive pick-up. D. General Handling - DO NOT touch the surface of the die. It is recommended that the MAAM26100 die be handled along the long side with a sharp pair of tweezers. Rev. V6
Typical Bias Configuration 5,6
VDD (VD1, VD2)
1000 pF minimum
RF IN
RF OUT
VGG (VG1, VG2)
5. Nominal bias is obtained by first connecting -1.3 volts to pads VG1 and VG2 followed by connecting +8 volts to pads VD1 and VD2 (note sequence). 6. The recommended VDD range is +6 to +9 volts.
Mounting
The MAAM26100 is back-metallized with Pd/Ni/Au (100/1,000/30,000A) metallization. It is recommended that the die be mounted with Au/Sn eutectic preforms. The attachment surface should be clean and flat. A. An 80/20 preform is recommended with a work surface temperature of approximately 255C and a tool temperature of 265C. When hot 90/5 nitrogen/hydrogen gas is applied, solder temperature should be approximately 290C. B. DO NOT expose the MAAM26100 to a temperature greater than 320C for more than 20 seconds. No more than 3 seconds of scrubbing should be required for attachment.
Bonding Table7
Bin # 1 2 3 4 Bond Pads E1 to VG1, E2 to VG2 D1 to VG1, D2 to VG2 C1 to VG1, C2 to VG2 B1 to VG1, B2 to VG2
7. Optional on-chip resistor networks are used by connecting a nominal -5 volts to the pad VGG then connecting pads per the bonding table. Each gel pack is labeled with a CD # which corresponds to a Bin # in the bonding table. For example, CD1 on the gel pack corresponds to Bin 1, which means that pad E1 must be connected to pad VG1 and pad E2 must be connected to pad VG2.
Bonding
A. Ball or wedge bond with 1.0 mil diameter gold wire of 3.0 mil x 0.5 mil ribbon. Thermosonic bonding with a nominal stage temperature of 150C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Ultrasonic energy and time should be adjusted to the minimum levels necessary to achieve reliable bonds. B. Bonds should be started on the die and terminated on the package. C. Bonding pads are 4.0 x 4.0 mils minimum.
4
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 * Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, * India Tel: +91.80.43537383 * China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.
MAAM26100
GaAs MMIC Power Amplifier 2.0 - 6.5 GHz
Outline Drawing
Rev. V6
3
4
5
6
7
2 2 7
9 1 0
2 2 2
2 2
2 1 1
1
1 1
1 1 1
Pad Configuration 8 Die Size: 2.342 x 1.802 x 0.102 mm (nominal)
Pad No. 3 4 5 6 7 9 10 11 12 13 14 15 X (mm) Y (mm) Pad Size nominal nominal (mm) 0 0.6435 0.9235 1.0885 1.954 1.979 1.979 1.564 1.413 1.263 1.213 1.413 0 0 0 0 0 0.640 0.840 1.420 1.380 1.420 1.580 1.580 .10 x .10 .10 x .10 .10 x .10 .15 x .10 .15 x .10 .10 x .10 .10 x .20 .10 x .10 .10 x .10 .10 x .10 .15 x .10 .15 x .10 Description VD1 VGG VG2 GND VD2 GND RFOUT B2 C2 D2 E2 VG2 Pad No. 16 17 19 20 21 22 23 24 26 27 28 X (mm) Y (mm) Pad Size nominal nominal (mm) 1.613 1.942 0.5525 0.5025 0.3525 0.2025 0.1525 0.0025 0.3525 -0.141 -0.141 1.580 1.580 1.580 1.420 1.380 1.420 1.580 1.580 1.580 0.840 0.640 .10 x .10 .10 x .10 .10 x .10 .10 x .10 .10 x .10 .10 x .10 .10 x .10 .10 x .10 .10 x .10 .10 x .20 .10 x .10 Description A2 GND A1 B1 C1 D1 E1 GND VG1 RFIN GND
8. All X,Y locations are at pad center. 5
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 * Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, * India Tel: +91.80.43537383 * China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.


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